Keynote Speakers

Tarun Amla

Executive Vice President and Chief Technology Officer
Isola Group, USA


Keynote: Engineered Dielectrics as Enabling Platforms for Ultrahigh Speed and Millimeter-wave Applications

Tarun Amla is Isola’s Executive Vice President and Chief Technology Officer, responsible for leading the company’s worldwide efforts in R&D and engineering. Tarun also directs the company’s OEM-marketing organization, which works closely with the world’s leading electronic OEMs and equipment designers to understand their requirements for innovative new materials.

Tarun’s career in the electronics and electronics materials industry spans more than 25 years. He has experience in general management, manufacturing operations, engineering, product technology, marketing and sales.

His areas of specific technical expertise include Computational fluid dynamics, Signal integrity, Computational mechanics and Electromagnetics, Operations Research, Product design and process modeling. He is an inventor listed on 7 pending and issued U.S. patents and 19 pending and issued foreign patents.

Tarun has a Bachelor of Technology degree in mechanical engineering from the National Institute of Technology, Calicut, India. He also holds a Master of Engineering degree from Arizona State University, with an emphasis on modeling and simulation; a Master of Science degree in mechanical engineering with a concentration in computational mechanics from Purdue University and an MBA degree from Northwestern University’s Kellogg School of Management.

Klaus-Dieter Lang

Professor at Techinische Universität Berlin and Director of Fraunhofer IZM, Germany


Keynote: System Integration Technologies for Next Generation Miniaturized Electronic Systems

Klaus-Dieter Lang studied electrical engineering at the Humboldt University (HU), Berlin, Germany. He received the M.Sc. degree in 1981 and two doctorate degrees in 1985 and 1989, respectively.

In 1981, he joined the HU as a Researcher, where he was involved in microelectronic assembly, packaging, and quality assurance up till 1991. In 1991, he joined SLV Hannover to build up a department for microelectronic and optic components manufacturing. In 1993, he became the Department Manager for Chip Interconnections at the Fraunhofer Institute for Reliability and Microintegration (IZM), Berlin, where he was the Director’s Personal Assistant from 1995 to 2000, and also responsible for Marketing and Public Relations. From 2001 to 2005, he coordinated the Branch Lab “Microsystem Engineering,” Adlershof, Berlin. From 2003 to 2005, he was the Head of the Department “Photonic and Power System Assembly” and from 2006 to 2010 he has been the Deputy Director of IZM.

Since 2011, he has been the Director of Fraunhofer IZM and a Professor at the Technical University Berlin, where he is responsible for the Chair “Nano Interconnect Technologies”. He is the author or coauthor of three books and more than 130 publications in the field of wire bonding, microelectronic packaging, microsystems technologies and chip on board.

Prof. Lang is member of numerous scientific boards and conference committees, which include the Semiconductor Equipment and Materials International (SEMI) Award Committee, the Scientific Advisory Board of European Cluster of Electronic Packaging and Integration of Microdevices and Smart Systems (EURIPIDES), the Executive Board of VDE-GMM, and the Scientific Chair of the Conference “Technologies of Printed Circuit Boards,” and “SMT/HYBRID/PACKAGING.” He is a member of the Deutscher Verband fur Schweißen und verwandte Verfahren eV (DVS and International Microelectronic Assembly and Packaging Society, and plays an active role in the international packaging community as well as in conference organization.

Invited Speakers

Stefano Grivet-Talocia

Associate Professor, Politecnico di Torino, Italy


Title of Talk: Macromodeling of Lumped and Distributed Interconnects: An Overview

Stefano Grivet-Talocia received the Laurea and the Ph.D. degrees in electronic engineering from Politecnico di Torino, Italy. From 1994 to 1996, he was with the NASA/Goddard Space Flight Center, Greenbelt, MD, USA. Currently, he is an Associate Professor of Circuit Theory with Politecnico di Torino. His research interests are in passive macromodeling of lumped and distributed interconnect structures, model order reduction, modeling and simulation of fields, circuits, and their interaction, wavelets, time-frequency transforms, and their applications. He is author of more than 150 journal and conference papers. He is co-recipient of the 2007 Best Paper Award of the IEEE Trans. Advanced Packaging. He received the IBM Shared University Research (SUR) Award in 2007, 2008 and 2009. Dr. Grivet-Talocia served as Associate Editor for the IEEE Transactions on Electromagnetic Compatibility from 1999 to 2001. He is co-founder and President of IdemWorks.

Dries Vande Ginste

Associate Professor, Ghent University Belgium


Title of Talk: State of the Art in Polynomial Chaos Based Stochastic Modeling of Interconnects, Passive and Active Circuits

Dries Vande Ginste received the M.S. degree and the Ph.D. degree in electrical engineering from Ghent University, Gent, Belgium, in 2000 and 2005, respectively.

He is currently an Associate Professor with the Electromagnetics Group, Department of Information Technology, Ghent University and a Guest Professor at iMinds. In June and July 2004, he was a Visiting Scientist at the Department of Electrical and Computer Engineering, University of Illinois at Urbana-Champaign (UIUC), IL, USA. From September to November 2011, he was a Visiting Professor at the EMC Group, Dipartimento di Elettronica, Politecnico di Torino, Italy. His research interests include computational electromagnetics, electromagnetic compatibility, signal and power integrity, and antenna design.

Dr. Vande Ginste was awarded the International Union of Radio Science (URSI) Young Scientist Award at the 2011 URSI General Assembly and Scientific Symposium, the Best Poster Paper Award at the 2012 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS), the Best Paper Award at the 2013 IEEE Workshop on Signal and Power Integrity (SPI) and the Best Paper Award at the 2013 IEEE International Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS). He served as the co-chair of the 2014 IEEE Workshop on Signal and Power Integrity. He is a Senior Member of the IEEE.

Giulio Antonini

Professor, Università degli Studi dell’Aquila, Italy


Title of Talk: The PEEC Method for EMC/EMI/SI Applications

Giulio Antonini received the Laurea degree (summa cum laude) in Electrical Engineering in 1994 from theUniversity of L’Aquila and the Ph.D. degree in Electrical Engineering in 1998 from the University of Rome “La Sapienza”. Since 1998 he has been with the UAq EMC Laboratory, Department of Electrical Engineering of the University of L’Aquila where he is actually Associate Professor. His research interests focus on EMC analysis, numerical modeling and in the field of Signal Integrity for high-speed digital systems. In 1998 he received the Best Transactions Paper Award for the best paper published in the IEEE Transactions on Electromagnetic Compatibility in 1997. In 2004, 2005 and 2006 he was awarded with the IBM Shared University Research (SUR) Award. In 2004 he received the CST University Publication Award for the best paper based on Finite Integration Technique. In 2006 he received a Technical Achievement Award from the IEEE EMC Society “For innovative contributions to computational electromagnetic on the Partial Element Equivalent Circuit (PEEC) technique for EMC applications”. He is the recipient of the 2007 IET-SMT Best Paper Award. Since 1998 he collaborates with the IBM T.J. Watson Research Center (New York) in the development of algorithms for PEEC modeling. Prof. Antonini is Chair of the IEEE EMC Italy Chapter, the Chair of the TC-10 Committee and a member of the TC-9 committee of the IEEE EMC Society. He has been Distinguished Lecturer of the IEEE EMC Society for the period 2010-2011. He serves as member of the Editorial Board of IET Science, Measurements and Technology and as reviewer in a number of IEEE-IET journals.

Davy Pissoort

Assitant Professor, KU Leuven, Belgium


Title of Talk: High-frequency Characterization of on-board EMI Shielding and Mitigation

Davy Pissoort was born in 1978. He received theM.S. and Ph.D. degrees in electrical engineering from Ghent University, Ghent, Belgium, in 2001 and 2005, respectively. From October 2005 to October 2006, he was a Postdoctoral Researcher Ghent University, Belgium. From November 2006 to July 2009, he was a Research Engineer at the Eesof-EDA Department of Agilent Technolgies in Belgium. Since August 2009, he is Assistant Professor at KU Leuven, Campus Ostend, Belgium where he is also head of the research group Reliability in Mechatronics and ICT. His current research interests include the development of fast and efficiënt electromagnetic modelling methods for EMC, SI and PI, the development of characterization methods for shielding materials and gaskets, as well as the analysis and testing of the mechanical and thermal reliability of electronic modules. He is Senior Member of the IEEE EMC Society and member of the International Steering Committee of EMC Europe. In September 2013 he was vice-chair for the EMC Europe 2013 Symposium in Brugge, Belgium.

Hubert Harrer

Senior Technical Staff Member, IBM Server and Technology Group, Germany


Title of Talk: Electrical Design Challenges in High End Servers

Dr. Hubert Harrer is a Senior Technical Staff Member (STSM) working in the IBM Server and Technology Group. He received his Dipl.-Ing. degree in 1989 and his Ph.D. degree in 1992 from the Technical University of Munich. In 1993 he received a DFG (Deutsche Forschungsgemeinschaft) research grant to work at the University of California at Berkeley in the paradigm of Cellular Neural Networks.

Since 1994 he has worked for IBM in the Boeblingen Packaging Department. In 1999 he was on international assignment at IBM Poughkeepsie, New York. He was leading the z900 MCM designs and is the technical lead for z-series CEC packaging designs since 2001. This includes the systems z990, z9, z10, z196, EC12 and z13 mainframe computers. His technical interests focus on system design, packaging technology, high frequency designs and electrical analysis for first and second level packaging. He has published multiple papers and holds 26 patents in the area of packaging.

Dipanjan Gope

Assistant Professor, Indian Institute of Science, Bangalore, India


Title of Talk: Opportunities in 3D Full-Wave Solutions for SI and PI Problems

Dipanjan Gope, PhD, is Assistant Professor in Electrical Communication Engineering at Indian Institute of Science, Bangalore. His research interests include computational electromagnetics with applications in signal integrity, power integrity, EMI for high speed chip-package-systems, parallel programming for many-core and cloud computing. Dr. Gope was a founding member of Nimbic (acquired by Mentor Graphics in 2014) where he served as Vice President, R&D from 2007-2011 and 2013-2014. Dr. Gope received his PhD and M.S. degrees in Electrical Engineering from the University of Washington, Seattle and BTech in Electronics and Electrical Communication Engineering from the Indian Institute of Technology, Kharagpur.

Jan Niehof

Research Scientist, NXP Semiconductors, Holland


Title of Talk: Preventing RFIC Interference Issues: Floorplan Development, Isolation- and Grounding Strategy

Jan Niehof obtained his Ph.D. degree at the University of Twente in 1994, for his work on Modelling the Reliability of IC Interconnects. He then joined Philips Research, where initially he was responsible for the development of advanced ElectroMagnetic simulation tools. He was responsible for and has participated in several EM and RF simulation- and consultancy projects. Since January 2010 Jan is working on integrated RF transceiver design within the Research division of NXP Semiconductors. Jan has been involved in organizing and chairing several workshops at the RFIC/IMS over the past years. Recent conference and workshop presentations were given at RFIC/IMS, SPI, EuMW and EMC Compo.

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