Submission is closed!

 

DEADLINES

  1. Notification about acceptance will be given by March 16, 2015.
  2. Accepted papers are reproduced in the Workshop proceedings.

The symposium will include both oral and poster sessions. In addition, a number of prominent experts will be giving keynote lectures and tutorials on areas of emerging interest. The official language is English.

TOPICS

  1. Emerging and advanced issues
  2. New design techniques and innovative architectures
  3. Novel CAD concepts, methodologies and algorithms for modeling, simulation and optimization

with emphasis on:

  •  Innovative schemes for SI and PI
  •  Noise reduction techniques
  •  High-speed link design and modeling
  •  Power distribution networks
  •  Electronic packages and microsystems
  •  3D technologies for IC and packages
  •  RF, microwave, mixed signal packaging
  •  Nano-interconnects and nano-structures
  •  Electromagnetic theory and modeling
  •  Transmission line theory and modeling
  •  Macro-modeling, reduced order models
  •  Simulation tools for SI and PI
  •  Electromagnetic Compatibility
  •  Design methodology/flow
  •  Measurements
  •  Jitter and noise modeling
  •  Chip-package co-design
  •  Novel CAD concepts